多单管合束技术是获得高输出功率密度半导体激光器的重要方法, 但其存在封装方式单一、体积大等问题, 难以满足更高功率密度和较好光束质量的需求。本文设计了一种多单管半导体激光器堆叠排布的封装结构, 通过将多个单管半导体激光器垂直封装在辅助热沉之间, 使得器件更加小型化, 在充分利用单管半导体激光器优势的同时, 既增加了单管半导体激光器的散热通道, 又实现了在体积不增加的基础上提高输出功率。通过ZEMAX软件对3个单管进行了空间合束模拟, 将光束耦合进芯径200 μm、数值孔径0.22的光纤中, 可以达到28.6 W的激光输出, 耦合效率为95%。

Multi-single diode laser emitters combination technology is an important method to obtain semiconductor lasers with high output power density. The difficulty of simplex packaging method and large volume restricts their application of high power and high optical quality. In this paper, a packaging structure with vertically stacked arrangement of multi-single emitters diode lasers is designed by vertically encapsulating single diode laser emitters between auxiliary heat sinks, making the device more miniaturization. This method can not only increase the heat dissipation channel of the single diode laser emitters, but also realize the improvement of output power without increasing the volume. In simulation, with ZEMAX optical design software, 3 single emitters diode lasers are coupled into a fiber with core diameter of 200 μm and NA of 0.22. The simulation results of the maximum output power of 28.6 W and the coupling efficiency of 95% were obtained.