中国激光, 2003, 30 (10): 953, 网络出版: 2006-06-27
紫外激光刻蚀多层线路板初步研究
Ablation of Circuit Board by Pulsed UV Laser
摘要
描述了固体倍频紫外激光在355 nm和266 nm,不同聚焦透镜实验条件下,对多层电路板的微刻蚀实验,进行了其传热一维模型的理论推导,并得到了在实验条件下最佳的理论参数为波长266 nm,峰值功率大于2×10 6 J/s,聚焦透镜焦距为200 mm,为激光修复多层线路板的工业应用提供了一定的实验依据。
Abstract
A technique using pulsed UV laser to process or correct the circuit boards was studied. The influences of the laser wavelengthes, pulse energy and lens focus length on the circuit ablation were investigated, and the optimal parameters were got.
凌磊, 楼祺洪, 叶震寰, 董景星, 魏运荣. 紫外激光刻蚀多层线路板初步研究[J]. 中国激光, 2003, 30(10): 953. 凌磊, 楼祺洪, 叶震寰, 董景星, 魏运荣. Ablation of Circuit Board by Pulsed UV Laser[J]. Chinese Journal of Lasers, 2003, 30(10): 953.