对高功率二极管封装工艺中的焊接技术进行了研究,掌握了高真空下利用蒸发沉积制备铟(In)焊料的方法,在不加助焊剂的情况下进行了多层焊接实验,并对封装的连续、准连续激光器进行了性能检测.结果表明,利用In和In-Sn合金的多层焊接技术进行激光器封装的方法是切实可行的.

The bonding technique of high power diode laser package is studied and the method of making indium solder with evaporating deposition in high vacuum is mastered. The multiplayer bonding experiment is carried out without scaling powder. The performances of packaged CW and QCW lasers are measured. The experiment's results show that multilayer bonding technique with indium and InSn alloy for laser package is practical.