基于激光电子散斑技术(ESPI)可测量微小形变和位移的原理,对超大规模集成电路(VLSI)进行了热稳定性测试。由实验分别得到了两片同型号CPU在相同热加载时的电子散斑图,利用离面位移的近似计算公式,求出各热加载下的离面位移值,进而拟合出了离面位移随热量的变化曲线。通过分析曲线的变化规律,推测出了CPU的热稳定性和热可靠性的优劣。该检测方法具有快捷、无损以及可信度高等特点,不仅能够适用于大规模集成电路封装的热可靠性测试,而且在诸多电子器件、光电子器件的热特性和封装可靠性测试中,也具有十分重要的推广应用价值。

Based on the principle that it is possible to test minuteness displacement and deformation with electronic speckle pattern interferometry (ESPI), the heat reliability of very large scale integration (VLSI) is tested. The speckle pictures of two different CPU under different heat load are obtained experimentally. By using the approximate formula of off-surface displacement. The off-surface displacement values are calculated and the simulation curve of off-surface displacement with heat is plotted. Through analyzing the changes of curve, the heat reliability and the stability of CPU are expressed. Because this test means is fast nondestructive and with high reliability, it can not only fit for heat reliability test of VLSI package, but also for package reliability test of many other electronic and photo-electronic devices.