通过对铜微通道冷却器的散热分析,设计出5层结构的模块式铜微通道冷却器.采用常规的线切割工艺加工,散热通道宽大约200μm,深300μm,各层间用真空钎焊的方法组装.该冷却器对于腔长0.6mm、宽10mm的线阵激光二极管芯片热阻为0.58℃/W.通过面阵激光二极管封装实验证明,该冷却器可用于10%占空比工作的面阵激光二极管封装.

The thermal resistance of copper micro-channels cooler was analyzed, and a stackable copper micro-channels cooler with five layers was designed in this paper. The line cutting is adoted in the cooler process, the channel of each layer is 0.2mm wide and 0.3mm deep, the layers are assembled with vacuum solder, the thermal resistance of the cooler for DL with the cavity length of 0.6mm and width of 10mm is measured as 0.58℃/W. It was proved by experiment that the cooler was suitable for DL package with 10% duty cycle work.