Chinese Optics Letters, 2004, 2 (9): 09541, Published Online: Jun. 6, 2006
Avoiding silicon/glass bonding damage with fusion bonding method
220.4000 microstructure fabrication 140.3390 laser materials processing 160.2750 glass and other amorphous materials 160.6000 semiconductors including MQW
Abstract
A novel fusion bonding method between silicon and glass with Nd:YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 μm, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.
Daohong Yang, Chen Xu, Guangdi Shen. Avoiding silicon/glass bonding damage with fusion bonding method[J]. Chinese Optics Letters, 2004, 2(9): 09541.
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