光电子技术, 2004, 24 (3): 177, 网络出版: 2006-06-08
高平均功率面阵二极管激光器封装
The Package of High Average Power Diode Laser Array
摘要
对激光二极管中冷却和界面联接热阻两个关键环节进行了分析,设计了一种五层结构的模块式铜微通道冷却器,对于腔长0.9 mm、宽10 mm的线阵激光器二极管(DL)芯片热阻为0.39℃/W.对冷却器进行了面阵DL封装实验,在工作电流52 A,电压41.4 V时,封装的面阵DL输出功率1005 W,电光效率45%,中心波长807.3 nm,谱宽约2.2 nm.经快轴准直后整个面阵输出激光的发散角小于2°(快轴)×12°(慢轴).
Abstract
The copper micro-channel cooler is designed for diode laser by analyzing of two keys, cooling techique and interfacial heat removal. The thermal impedance of cooler is 0.39 °C/W for 10 mm length and 0.9 mm wide diode lasers bar. The diode laser array is packaged with the micro-channel cooler, the average output power of diode array is 1 005 W with 52A current and 41.4 V voltage at 807.2 nm center wavelength and 2.2 nm FWHM. The divergence of array is less than 2 degree in the fast-axis and 12 degree in the slow-axis.
高松信, 吕文强, 魏彬, 武德勇, 唐淳, 邵冬竹, 蒋全伟, 左蔚. 高平均功率面阵二极管激光器封装[J]. 光电子技术, 2004, 24(3): 177. 高松信, 吕文强, 魏彬, 武德勇, 唐淳, 邵冬竹, 蒋全伟, 左蔚. The Package of High Average Power Diode Laser Array[J]. Optoelectronic Technology, 2004, 24(3): 177.
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