为了研究不同纳秒激光工艺参量(波长、能量密度、扫描速率)以及铜层厚度对激光刻蚀覆铜板质量(包括刻蚀深度及加工面粗糙度)的影响, 采用50W的1064nm红外光纤激光器和10W的355nm紫外固体激光器对覆铜板进行了对比刻蚀实验。通过分析红外、紫外激光刻蚀覆铜板材料的作用机理并对比实验结果得知, 采用1064nm红外光纤激光作为激光光源时, 设置合适的刻蚀参量, 能在完全去除铜箔层的条件下, 最大限度地保证环氧树脂基底的完整性; 而采用355nm的紫外激光作为激光光源时, 因环氧树脂材料对紫外波段激光的高吸收率, 以及紫外激光对有机材料的光化学作用, 基底材料的损伤难以避免, 此外, 红外光纤激光具有较高的刻蚀效率。结果表明, 综合光纤激光器高稳定性和高集成度的特点, 若激光直接刻蚀技术被用于大规模覆铜板的工业加工中, 红外光纤激光将更具优势性。

In order to study effect of nanosecond laser processing parameters (such as wavelength, laser fluence, scanning speed) and thickness of the copper layer on the processing quality of laser etching copper clad laminate (including depth and roughness), a 50W 1064nm infrared fiber laser and a 10W 355nm ultraviolet solid-state laser were used for etching the copper clad laminate(CCL) in the comparative experiments. The action mechanisms of infrared laser and ultraviolet laser were analyzed. In the experiments, the 1064nm fiber laser with proper process parameters could etch the copper layer entirely and keep epoxy resin board intact. However, for the 355nm laser, the damage to the organic layer was unavoidable because of the high absorptivity to ultraviolet and photochemical effect. Besides, the infrared fiber laser had a higher processing efficiency. Therefore, with characteristics of high stability and stronger integration, 1064nm infrared fiber laser is more adapt to the large-scale industrial processing of CCL.