光子学报, 2006, 35 (9): 1325, 网络出版: 2010-06-03
铜片封装光纤光栅传感器的应变和温度传感特性研究
Study on the Strain and Temperature Densing Characteristics of FBG Packaged by the Copper slice
摘要
提出了一种光纤光栅的铜片封装工艺,并通过实验和理论分析研究了光纤光栅的应变和温度传感特性.与裸光纤光栅的测试结果相比,铜片封装工艺基本不改变光纤光栅应变传感的灵敏度,但是温度灵敏度系数提高了2.78倍.经过铜片封装后的光纤光栅可以探测到的应变和温度分别为1με和0.03℃,便于工程应用.
Abstract
In this paper,the copper slice packaging technique for FBG sensor was developed in consideration of bare optical fiber being fragility,and then the strain and temperature characteristics of the packaged FBG sensor were experimentally and theoretically studied. Compared with the experimental results of the bare FBG,the strain sensing property of the FBG sensor packaged by the copper slice is nearly the same as that of the bare FBG,however the temperature sensing ability of the packaged FBG sensor is improved and the temperature sensitivity coefficient is 2.78 times as much as that of the bare FBG. The strain and temperature resolution of the packaged FBG sensor are 1με and 0.03℃. The packaged FBG sensors can be used easily in engineering.
于秀娟, 余有龙, 张敏, 廖延彪, 赖淑蓉. 铜片封装光纤光栅传感器的应变和温度传感特性研究[J]. 光子学报, 2006, 35(9): 1325. Yu Xiujuan, Yu Yonglong, Zhang Min, Liao Yanbiao, Lai Shurong. Study on the Strain and Temperature Densing Characteristics of FBG Packaged by the Copper slice[J]. ACTA PHOTONICA SINICA, 2006, 35(9): 1325.