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铜片封装光纤光栅传感器的应变和温度传感特性研究

Study on the Strain and Temperature Densing Characteristics of FBG Packaged by the Copper slice

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摘要

提出了一种光纤光栅的铜片封装工艺,并通过实验和理论分析研究了光纤光栅的应变和温度传感特性.与裸光纤光栅的测试结果相比,铜片封装工艺基本不改变光纤光栅应变传感的灵敏度,但是温度灵敏度系数提高了2.78倍.经过铜片封装后的光纤光栅可以探测到的应变和温度分别为1με和0.03℃,便于工程应用.

Abstract

In this paper,the copper slice packaging technique for FBG sensor was developed in consideration of bare optical fiber being fragility,and then the strain and temperature characteristics of the packaged FBG sensor were experimentally and theoretically studied. Compared with the experimental results of the bare FBG,the strain sensing property of the FBG sensor packaged by the copper slice is nearly the same as that of the bare FBG,however the temperature sensing ability of the packaged FBG sensor is improved and the temperature sensitivity coefficient is 2.78 times as much as that of the bare FBG. The strain and temperature resolution of the packaged FBG sensor are 1με and 0.03℃. The packaged FBG sensors can be used easily in engineering.

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中图分类号:TP212

所属栏目:光学传感器

基金项目:国家自然科学基金与中国节能投资公司联合研究基金(60177029)、国家863高技术计划(2001AA602011-11)资助

收稿日期:2005-06-13

修改稿日期:--

网络出版日期:0001-01-01

作者单位    点击查看

于秀娟:黑龙江大学光纤技术研究所,哈尔滨 150080清华大学电子工程系光纤传感实验室,北京 100084
余有龙:黑龙江大学光纤技术研究所,哈尔滨 150080暨南大学光电工程系,广州 510632
张敏:清华大学电子工程系光纤传感实验室,北京 100084
廖延彪:清华大学电子工程系光纤传感实验室,北京 100084
赖淑蓉:清华大学电子工程系光纤传感实验室,北京 100084

联系人作者:于秀娟(xiujuanyu@163.com)

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