设计并试制了由软光刻法转印,可敷设在印刷电路板上用于芯片间互连的光学互连线路。提出了一种新颖的端口耦合结构,并发现在耦合适配段长度与接收窗口的长度比值为12∶1时耦合效率最佳,且该耦合结构有效降低了对安装精度的要求;分析了该光学互连线路在交叉布线时的基本准则,获得对于不同横截面矩形波导结构在交叉布线时呈现的串扰与交叉角度的相关性,并发现在强束缚下交叉角度大于54°的交叉结构都能达到低串扰(小于-30 dB)。采用软光刻技术制作了上述高聚物波导光学互连线路元件,实验测量结果与设计数据符合较好。与传统的光刻或激光直写技术相比,软光刻转印具有制作简单,易于实现高聚物三维结构的大批量高精度复制。

A soft-lithography based optical interconnection circuit for inter-chip communications on printed circuit board (PCB) was designed, fabricated and characterized. A novel circuit termination coupler was proposed, capable of easing the coupling between transceiver and waveguide significantly and reducing the demand for installing precision, and it was found that an optimum coupling was achieved at a ratio of 12∶1 between the lengths of beam duct and entrance/exit window. The fundamental circuit layout criteria were analyzed for waveguide intersections, and the crosstalks between crossed waveguides were calculated as a function of both various waveguide cross-sections and crossing angles. It was found that cross-talk would be lower than -30 dB for crossing angles greater than 54° in the case of strong bounding. Polymer devices for optical intercomnection circuit are fabricated experimentally. Experimental measurement for both coupling structure and cross-over circuit elements were compared with calculated results and a reasonably good agreement was obtained. In contrast with traditional lithography or laser direct writing, soft lithography features a simple fabrication process and high-precision duplication of polymer three-dimensional structure in quantity.