用扫描电镜(SEM)观察了化学沉积Ni-P合金薄膜/单晶硅基体的结构与颗粒度,利用X射线衍射(XRD)技术测试了其化学沉积后的残余应力,测量了激光热处理后残余应力的变化规律,分析了残余应力对磨损性能及界面结合强度的影响。实验结果表明,化学沉积Ni-P合金薄膜/硅基体的残余应力均表现为拉应力,经过激光热处理后残余应力发生了变化,由高值的拉应力变为低值的拉应力或压应力；薄膜残余应力对其磨损性能有明显的影响,其磨损量随着残余应力的减小而减小；薄膜与基体结合强度随着残余应力的增大而减小,合理地选择激光热处理参数可以精确地控制薄膜残余应力,提高其结合强度。

The structures and particle size of Ni-P alloy film coated on single crystal silicon substrate by chemical deposition were observed with scanning electron microscope (SEM), and its residual stresses after chemical deposition were measured by X-ray diffraction (XRD). At the same time, residual stresses of Ni-P alloy film coated on silicon substrate by laser heat treatment were measured, and effects of residual stress of the film on wear property and interfacial bonding strength were analyzed. The experimental results showed that residual stresses of Ni-P alloy film coated on silicon substrate by chemical deposition are behaved as tensile stress, its residual stresses vary after laser heat treatment, and high tensile tress is changed into low tensile stress or compressive stress. The effect of residual stress of the film on its wear property is obvious, and its wear extent decreases with fall of residual stress. Bonding strength of the film-substrate system decreases with residual stress increase, and reasonable parameters of laser heat treatment may control residual stress of the film accurately, and increase bonding strength of the film-substrate.