基于冷喷涂技术, 提出了一种替代传统100 W白炽灯的新型12 W LED球泡灯, 其散热器由纯铝板裁剪和弯折而成。在分析铜基板内部结构基础上, 借助ANSYS软件模拟不同覆铜层厚度和不同形状散热器的球泡灯温度场, 获得了具有最低芯片结温的LED球泡灯。研究结果表明, 铜基板厚度一定时, 芯片结温随覆铜层厚度的增加而降低。选择纯铝质散热器和增加覆铜层厚度可使LED球泡灯的结温降低为71.25 ℃, 低于芯片安全温度85 ℃, 满足散热和照明习惯要求。

A new-type 12 W LED bulb was proposed based on the cold spray technology and the integrated design of an aluminous heat sink to replace the traditional incandescent bulb. The heat sink was made of aluminum and manufactured by cutting and bending. The temperature fields for the different shape LED bulbs were simulated by ANSYS to obtain the optimal shape with the lowest temperature. The internal structure of the copper-based plate was analyzed. Meanwhile, simulation was performed to get the temperature fields with the different copper circuit layers. The results show that the junction temperature of LED decreases with the thickness of the copper circuit layer when the thickness of the copper-based plate keeps constant. The maximum junction temperature of the 12 W LED bulb is 71.252 ℃ lower than the safe temperature of 85 ℃. It implies that the new-type 12 W LED bulb could meet the requirements of heat dissipation and lighting habits.