设计并制作了一种紧凑型高聚物光功率分配器,该器件长度比传统器件结构缩短近1/3,实现了器件的微型化改进。利用设计仿真工具BeamProp对器件所需参量进行详细的筛选分析,最终确定了器件结构的具体数值。采用极具优势的软光刻技术印制成功高聚物1×8光功率分配器,在实际的测量中所得损耗结果与模拟仿真符合较好。该器件很大程度上迎合了通信器件微型化的发展趋势,且所采用的制作工艺具有加工便捷,成型快速,成本低廉等独特优势,使器件的规模生产成为可能。

A novel compact polymeric multimode power splitter was designed and fabricated, with its overall length 30% shorter than the conventional Y-junction splitter. Using the simulation software BeamProp, we have done selective analysis to determine the parameters of the splitter. By using soft-lithography the 1×8 polymeric power splitters were prototyped and the measurement was in a good agreement with the calculated result. This splitter caters for the trend of micromation of the optical communication devices and the technology used features unique advantages of fast-easy producing, low-cost fabrication and possible mass-production.