研究了亚克力导光板的CO2激光精密高速钻孔工艺。具体采用激光脉冲划线的方式在亚克力基材上高速蚀刻出盲孔作为导光点，旨在提高亚克力基材对光线的漫反射，并优化激光单点能量、脉宽、重复频率、离焦量、切割速度、加速度等工艺条件使导光点满足工业用户对盲孔直径、蚀刻深度和孔间距等参数的需求。实验在光学级亚克力基材上高速钻出微孔，并利用光学检测设备对产品的导光效果进行了测试。实验结果表明：采用实际输出功率为100 W的CO2激光器，波长为10.6 μm，重复频率为8 kHz，激光脉宽为10 μs，切割速度为2500 mm/s，加速度为40000 mm/s2，离焦量为0.6 mm，使用首尾抑制脉冲技术在幅面为422 mm×242 mm的亚克力导光板上高速蚀刻出直径为157 μm，深度为30 μm，间距为300 μm的盲孔阵列作为导光点，亚克力导光板对光线的漫反射的均匀性、亮度等均满足工业客户的要求，并且钻孔效率可以高达2000 s-1。

The laser precision high-speed drilling on acrylic base plate using CO2 laser is investigated. By taking laser pulse scraping technology to etch the blind holes as light guide points, this work aimes at improving diffuse reflection of light on the acrylic base plate. The laser process parameters including laser pulse energy, pulse width, repeated frequency, offset of the focus spot, cutting speed and acceleration are optimized in the experiments to obtain the blind holes to satisfy the industrial requirement on the diameter as well as depth and spacing of microholes. The microholes are drilled on optical acrylic base material, and the effect of diffuse reflection with blind hole is tested by optical detection equipment. The experimental results show that under the conditions of CO2 laser with output average power of 100 W, wavelength of 10.6 μm, repeated frequency of 8 kHz, pulse width of 10 μs, cutting speed of 2500 mm/s, and acceleration of 40000 mm/s2, the light guide points with 157 μm-spacing as well as 30 μm-depth and 157 μm-diameter are obtained via laser high-speed drilling on the acrylic base plate with size of 422 mm×242 mm by the technology of both suppression laser pulses. The diffuse reflection of acrylic with blind holes are uniform and the light guide points are maximum brightness, and the laser drilling efficiency is up to 2000 s-1.