为了研究光纤激光软钎焊中激光脉冲频率和扫描方式对焊接质量的影响，通过用12 W的100%功率的SP-12P型脉冲式光纤激光扫描软钎焊系统在覆铜板上对Sn-Ag-Cu无铅钎料进行软钎焊实验，并对不同脉冲频率、不同扫描方式下的激光软钎焊技术进行实验研究。结果表明，在直线扫描方式下，高于超声波频率的500 kHz脉冲激光束作用于焊点时，会在钎料与焊盘之间的界面处发生空化作用，破碎氧化膜，使钎料在焊盘上润湿铺展，实现脉冲激光对无铅钎料Sn-Ag-Cu在覆铜板上的扫描软钎焊。

The welding quality is strongly affected by laser pulse frequency and scanning mode in laser soldering. Laser soldering was experimented on copper clad laminate with Sn-Ag-Cu lead-free solder with 100% 12 W power SP-12P fiber pulse laser soldering system, and laser soldering experiment was carried out with different pulse frequency and scanning mode. The results show that cavitations occur and oxide film is crushed on the interface between solder and bonding pad under linear scanning mode by 500 kHz laser. The solder is wet and spreads on the bonding pad, and then laser soldering comes true on the copper clad laminate with Sn-Ag-Cu lead-free solder by pulse laser scanning.