总结了一种应用于柔性线路板(Printed circuit board,PCB)高速打孔的新型激光加工系统，每分钟可以打孔18000个。柔性线路板传统制版工艺中的过孔会被油墨完全堵住，由于孔径小且数量繁多，加之软板个体存在变形和误差，因此这些油墨使用传统方法无法清除，这为产品带来了一定的隐患。为此，研制了一种新型激光高速柔性线路板打孔系统。采用2个高速振镜移动激光位置，配合伺服系统带动工作台快速移动，通过反馈系统精准定位，同时在计算机的控制下补偿柔性线路板软板的变形，另外采用光电系统对柔性线路板软板进行精准测量和定位。振镜的扫描范围为25 mm×25 mm，将柔性线路板分割成若干区域，依次加工，振镜和工作台位置相互配合，全部待加工孔的坐标值通过软件实施变换。

This article concludes the new type laser process system of our research which is used to drill 18000 holes on PCB soft board per minute. The via-holes are often jammed in the traditional PCB techniques. It is not easy to clean printing ink with traditional method. To solve this problem, we developed the laser high-speed PCB drilling system. Through two high-speed scan mirrors exchanging the position, the servo system pushing forward working plate, and the exact location of the response system, compensating the shape-change of PCB soft board under computer control. Measure and locate the PCB board with photo electricity system. In order to improve the speed of drilling, we suggested the scan mirror should be 25 mm×25 mm, divide the PCB into several areas, process individually and one by one. Cooperating the position of scan mirror and working plate, the reference frame transforming of holes would be done by software.