采用波长为532 nm 的短脉冲激光(脉宽6 ns)对Y-TZP陶瓷进行铣削实验研究。探究了单次刻蚀槽宽与功率的关系，分析脉冲数与材料阈值的关系，确定材料阈值。并且探究了铣削量及质量随激光工艺参数的变化规律，确定最优工艺参数，进一步进行了脉冲激光铣削微米级二维结构的工艺实验。研究结果表明槽宽的平方与脉冲峰值功率的对数呈线性关系，根据此关系式计算得出光斑半径与实际测量值相符。材料阈值随脉冲数增加而降低，在扫描速度、功率和重复频率的最优匹配下，可实现最大铣削量为1.35 mm3/min。在优化工艺参数下，完成直径500 μm 的盲孔和宽200 μm、高100 μm 的台阶方槽二维结构无裂纹铣削加工，结构边缘无残渣堆积，表面粗糙度为3.746 μm。

A short pulse(6 ns)laser with wavelength of 532 nm is employed to mill Y-TZP ceramic. The relationship between power and groove width by single-pass machining is explored, and the relationship between threshold and pulse number is analyzed to make sure the threshold of Y-TZP. Also the variation of removal rate and quality with different parameters is analyzed to determine the optimal process parameters further. the micron-sized twodimension structure is conducted further. The results show that the square of groove width is proportional to logarithmic peak pulse laser power, and the calculated laser spot radius is matched with measured value. The material threshold decreases with the increase in the number of pulses. The removal rate is up to the maximum, 1.35 mm3/min, in the optimum combination of scanning speed, power and repetition rate. The blind hole of diameter 500 mm and steps in square cavity structure of width 200 mm and depth 100 mm are obtained by optimizing laser processing parameters. The two-dimension structures are no crack and better processing quality and the surface roughness Ra is 3.746 mm.