157nm深紫外激光因其波长短且具有较高的光子能量,被视为较理想的微刻蚀工具之一。介绍了157nm深紫外激光的刻蚀机理,并利用先进的157nm激光微加工设备,进行了一系列微刻蚀实验。研究了激光工艺参数对石英玻璃的刻蚀效率和表面粗糙度的影响,进行了多种三维微结构的加工试验,证实了157nm激光微刻蚀工艺在制备MOEMS器件方面的实用性。

Due to the short wavelength and high photon energy,157nm deep-ultraviolet laser is considered as one of important micro ablation tools. In this paper,157nm laser micro ablation mechanism is introduced. For fused silica,the ablation depth and surface roughness are investigated after 157nm laser ablation. Finally,several three-dimensional micro-structures are produced in silica glass chip,which confirmed that 157nm laser is available on manufacturing MOEMS devices.