中国激光, 2010, 37 (5): 1398, 网络出版: 2010-05-11   

脉冲激光热应力切割Al2O3陶瓷板

Thermal Stress Cleaving of Al2O3 Ceramic Plate by Pulsed Laser
作者单位
南京理工大学 理学院,江苏 南京 210094
摘要
运用热应力切割脆性材料的可控断裂激光切割技术,是在切割过程中激光能量诱发的拉应力使材料沿光束移动方向分离来完成切割。材料的分离类似于裂纹的扩展且分离的过程是可控的。基于固体热传导理论,运用有限元方法建立了三维热弹计算模型。通过对脉冲激光扫描切割Al2O3陶瓷板过程中的温度场和应力场的变化情况进行模拟分析,得到了切割过程中温度场和热应力场的分布及随时间的变化规律。分析了激光照射陶瓷板期间,激光作用区域压应力与拉应力之间沿厚度方向的转化规律。进而根据可控断裂激光切割原理分析了陶瓷板裂纹沿脉冲激光扫描方向进行扩展的原因。
Abstract
In laser thermal stress cleaving of brittle materials using controlled fracture technique,the applied laser energy absorbed in a local area produces a tensile thermal stress that causes the material to separate along the moving direction of the laser beam. The material separation is similar to a crack extension and the fracture growth is controllable. A three-dimensional finite element thermoelastic calculational model with the heat transfer theory is established to investigate the process when pulsed laser is applied to cut the Al2O3 ceramic plate. The temperature field and thermal stress field at the area irradiated by the laser are simulated. During the laser pulse,the distribution of the tensile stress and compressive stress with depth is obtained. The mechanism of crack propagation is investigated by analyzing the development of the thermal stress field during the process.

刘剑, 陆建, 倪晓武, 戴罡, 陈彦北. 脉冲激光热应力切割Al2O3陶瓷板[J]. 中国激光, 2010, 37(5): 1398. Liu Jian, Lu Jian, Ni Xiaowu, Dai Gang, Chen Yanbei. Thermal Stress Cleaving of Al2O3 Ceramic Plate by Pulsed Laser[J]. Chinese Journal of Lasers, 2010, 37(5): 1398.

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