设计了一种半导体激光器模组以满足实际应用的需要。在半导体激光器模组设计中，激光 器选择、光学系统设计、激光器电路设计与“邦定”技术是模组设计的关键部分。论述了半导体激光器原理， 介绍了半导体激光器模组光学系统与电路设计，阐述了模组设计中“邦定”技术的工艺流程与关键技术。模组 中半导体激光器的波长为635nm，驱动电源在3V 5V之间，激光功率在2mW左右，光学系统由一个双胶合 透镜和一个正透镜组合而成，设计研制的半导体激光器模组满足设计要求。

A semiconductor laser groupware is designed to meet the needs in many fields. In the design of the semiconductor laser groupware, selection of lasers, design of an optical system and a laser circuit and the bonding technology are key factors. In this paper, the principle of a semiconductor laser is discussed. The design of the optical system and circuit for the semiconductor laser groupware is presented. The key bonding process and technology are described. The semiconductor laser in the groupware operates at the wavelength of 635nm and has a driving power source of 3V 5V and a laser power of about 2mW. The optical system is composed of a double lens and a convex lens. The semiconductor laser groupware developed can satisfy the design requirements.