采用UV-LIGA技术制作了超高金属微细阵列电极，并利用电解置桩的方法辅助去除SU-8胶。通过单次涂胶和提高前烘温度、降低后烘温度的方法制作了厚度达1 mm的SU-8胶结构；采取反接电极法在金属基底上电解得到微坑，增强电铸金属电极与金属基底的结合力，保证去胶后电铸金属的完整性。选取优化的工艺参数：单次注射式涂胶，前烘110 ℃/12 h，适量曝光剂量，分步后烘50 ℃/5 min、70 ℃/10 min、90 ℃/30 min，反接电极电解10 V/15 min等，获得了高900 μm、线宽300 μm的金属微细阵列电极结构。试验表明，UV-LIGA技术是一种高效、经济的制造超高微细阵列电极的有效手段。

UV-LIGA technology was investigated to fabricate the ultra-high micro electrode array, and the micro electrochemical machining was used as an aided method to remove the SU-8 resist.During the lithography process,a SU-8 mold up to 1 mm thick was fabricated on the substrate by methods of single coating,increasing soft bake temperature and decreasing post bake temperature.Before the electroforming process, a reverse polarity procedure was carried out to make the micro roots on the substrate, which could enhance the adhesion of the electroformed micro copper electrode array to the substrate.Using the optimized parameters: single coating; soft bake 110 ℃/12 h; post bake 50 ℃/5 min, 70 ℃/10 min, 90 ℃/30 min; electrochemcial machining 10 V/15 min et al., the micro electrode arrays with a heigh of 900 μm and a linewidth of 300 μm were fabricated.The result indicates that UV-LIGA is an excellent method for fabricating ultra-high metal micro electrode arrays.