为了提高金柱腔表面质量, 借助扫描电子显微镜及其附带的能量色散谱(EDS), 3维视频显微镜(SEM)等现代微观形貌观测手段和成分分析手段, 通过单因素实验, 分析了金柱腔缺陷形貌和组成以及缺陷产生的原因。探索了电流密度、金属杂质、有机污染物、预镀工艺及基底材质对镀层质量的影响, 并对其作用机理进行了探讨。实验结果表明: 对麻点和节瘤等缺陷抑制作用明显的工艺参数为, 金质量浓度13～22 g/L时, 电流密度的最佳范围为24～3.2 mA/cm2; 金质量浓度5～13 g/L时, 最佳范围为2.0～2.6 mA/cm2; 大电流冲击时间不超过1 min; 镀液无有机杂质污染; 芯轴无钝化。

The morphology, composition and causes of defects are analyzed to reduce defects on the gold layer prepared by electrochemical deposition from sulfite solution, and to improve the surface quality of sub-millimeter cylindrical gold targets, by means of SEM and EDS. The effects of current density, metallic impurity, organic pollution, pre-deposition parameters and mandrel quality on the quality of the gold plating are discussed, along with their mechanisms. The result indicates that the current density must be controlled strictly. The optimal current density ranges from 2.4 to 3.2 mA/cm2 when the concentration of gold ranges from 13 to 22 g/L, and from 2.0 to 2.6 mA/cm2 when the concentration of gold ranges from 5 to 13 g/L. The parameters of predeposition must be optimized and the predeposition time should be no longer than 1 minute to improve the surface quality. In addition, organic pollution should be removed from the bath, and the mandrels should be of good quality without oxide on their surfaces.