为了简化电容式振动环陀螺仪的制作方法，进一步提高成品率，提出了一种结合反应离子深刻蚀(DRIE)与阳极键合的陀螺仪制备方法。分析了振动环陀螺的工作原理，指出了传统工艺存在的缺陷；对该制作方法所采用的工艺流程进行了详细设计，分析了不同工艺参数对陀螺仪性能的影响，并依据分析和实验结果改进了工艺流程和参数。最后,采用该方法制作了振动环式微机械陀螺仪并进行了测试。实验结果表明，采用该方法能成功制作电容间隙为3 μm、厚度为80 μm的振动环式陀螺仪微结构。与传统的制作方法相比，工艺流程大为简化，掩模板数量从7块减少到2块，满足器件性能可靠、工艺简单、成品率高的要求。

In order to simplify the fabrication process of a vibrating ring gyroscope and to improve its finished products,a fabricating method combing Deep Reactive Ion Etching(DRIE) and anodic bonding technologies was proposed to fabricate sensor structures. The operating principles of the vibrating ring gyroscope and the technological drawbacks in the traditional fabrication process were discussed. Then, the processing flows based on DRIE and anodic bonding technologies were carefully designed,and the effect of different technological parameter on the gyroscope performance was analyzed. On the basis of the analyzed results,the technological flows and parameters were modified. Finally, a single-crystal silicon vibrating ring gyroscope with a high aspect ratio was fabricated and tested. Experimental results indicate that the proposed method can fabricate a vibrating ring gyroscope with 3 μm capacitance gaps and 80 μm depth.In comparison with traditional fabrication technologies, the number of masks has been reduced from 7 to 2,which meets the device requirements for simplicity and stabilization.