基于激光的直写技术具有加工周期短、使用灵活、无需掩模、环境要求低等诸多优点,其在微电子等领域应用广泛。本文引入了一种新的激光直写技术—激光微熔覆技术,介绍了该技术的工艺过程及特点,并在此基础上集成制造了激光微熔覆设备。通过激光与物质的相互作用原理,理论分析了激光微熔覆电子浆料的成型机理。最后,举例说明该技术在微电子、光电子以及传感器领域的应用,并对该技术的发展趋势进行了初步预测,认为该技术在混合集成电路基板的加工、微型传感器和加热器的制造、平面无源电子器件和分立无源电子器件的研制以及生物芯片、电子封装等领域有好的发展前景。

Laser-based direct-writing techniques have gained increased interests in the microelectronic industry, which have some outstanding advantages such as short processing cycles, strong flexibility, no mask, and low environmental requirements. A new technology called laser micro-cladding technology was presented in this paper and the principles and characteristics of the technology were described in detail. On the basis of a-bove researches, the equipment for laser micro cladding was assembled, then by studying the principle of interaction between laser and matter, the formation mechanism of laser micro cladding electronic pastes was analyzed. Finally, the applications of the technology to micro-electronic, optoelectronic and sensor areas were il-lustrated. Moreover, the development of this technology was predicted, and it was pointed out that the technology will show good prospects in fields of hybrid integrated circuit substrates, micro-sensors, micro-heaters, plane passive electronic devices, discrete devices, biochip and electronic packages.