锑化铟红外焦平面探测器将要在寿命周期中于室温到77K的温度范围内工作几千次。由于不同材料的热膨胀系数不一致， 热循环会造成焊点疲劳和失效，最终导致焦平面探测器失效。通过研制的温度循环设备，了解了铟焊点失效的原因，并用ANSYS 软件对铟柱的机械失效现象进行了分析。通过分析铟柱高度和可靠性之间的关系，得出铟柱高度的增加可以提高探测器的可靠性。介绍了焊 接可靠性的评价方法。改进后的焊接工艺可大幅提高探测器的可靠性。

An InSb infrared focal plane array (IRFPA) detector is required to operate in the temperature range from room temperature to 77K for several thousand times in its lifetime period. Due to the different thermal expansion coefficients of different materials, the bonding pads in the FPA detector can be fatigue and failure in thermal cycles and hence cause the detector to be failure. A thermal cycle equipment developed by North China Research Institute of Electro-optics is used to find the failure causes of indium solder-bumps and the ANSYS software is used to analyze the failure mechanism of the bumps. Through the analysis of the relationship between bump height and bond dependability, that the reliability of the detector can be improved by increasing its bump height is concluded. The method for evaluating bonding reliability is presented. By using the improved bonding process, the reliability of the detector can be enhanced greatly.