雪崩光电二极管(APD)光电探测器由于在灵敏度上的优势, 在长距离高速数字通信系统中得到了广泛的应用。文章系统地描述了高速APD/TIA(跨阻抗放大器)探测器组件的光学与微波封装的设计要点, 对完成封装后的10 Gbit/s APD/TIA探测器组件进行了全面的测试, 并对测试结果进行了分析。

Thanks to its advantages in sensitivity, APD photodetector has found extensive applications in long-haul high-rate digital communication systems. This article systematically describes the key points in the design of the optics and microwave packaging of high-rate APD/TIA detector assemblies, conducts a comprehensive test on the packaged assemblies and analyzes the test results.