激光与光电子学进展, 2011, 48 (5): 051403, 网络出版: 2011-05-09  

激光模切加工新技术的实验研究 下载: 581次

Experimental Study on New Technology of Laser Die-Cutting Processing
作者单位
1 天津大学精密仪器与光电子工程学院光电信息技术科学教育部重点实验室, 天津 300072
2 天津市力能激光技术有限公司, 天津 300072
摘要
为了改进传统包装纸盒模切工艺,进行了激光模切的实验研究。详细介绍了激光模切的工作原理,对振镜扫描方式的聚焦误差进行了分析,在采用射频CO2激光器、hurrySCAN14扫描头和RTC3通用激光控制卡等构建的数控激光模切系统上,进行了激光模切技术的研究。与传统机械模切相比,激光模切在小批量样品的生产中具有方便、灵活、生产周期短和效率高等独特的优点。
Abstract
To improve the die-cutting process of the traditional packaging carton, experiments of laser die-cutting have been done. Details of the working principle of laser die-cutting were introdued, and scanning precision of the focusing was analyzed. A laser die-cutting system with galvanometer, radio frequency CO2 laser, hurrySCAN14 scan head, RTC3 card and so on is built, and laser die-cutting has been done with this system. Compared with traditional mechanical cutting, laser die-cutting has lots of advantages, such as convenience, agility, short production cycle and higher efficiency especially in the packaging of small quantities samples.

许宝忠, 刘铁根, 王萌, 李梅, 张国顺. 激光模切加工新技术的实验研究[J]. 激光与光电子学进展, 2011, 48(5): 051403. Xu Baozhong, Liu Tiegen, Wang Meng, Li Mei, Zhang Guoshun. Experimental Study on New Technology of Laser Die-Cutting Processing[J]. Laser & Optoelectronics Progress, 2011, 48(5): 051403.

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