通过对激光器传热过程的理论分析，建立了同轴封装半导体激光器的物理散热模型，利用计算流体力学(CFD)软件对TO56和TO38两种同轴封装的半导体激光器进行了散热模拟分析，并设计了相关的实验(在激光器里面装上热敏电阻)对激光器管芯的温度进行检测，实验结果与仿真结果非常吻合，对激光器组件的设计有一定的指导意义。

A physical heat dissipation model of coaxially packaged LD is built on the basis of the theoretical analysis of laser heat transfer process. Heat dissipation simulation analysis is made of two types of such LD, TO56 and TO38, by using the Computational Fluid Dynamics (CFD) software and a relevant experiment, i.e. a thermal resistance is installed in the LD, is designed to test the temperature of the laser-chip on submount. The experimental results are in a good agreement with the simulation, which has a certain guiding significance to the laser subassembly design.