以10～12 mm厚致密Al2O3陶瓷为研究对象，采用CO2激光，以离散通孔密排分离新技术，实现了厚板陶瓷直线、曲线等自由加工路径的激光无损切割。采用扫描电镜(SEM)和激光共聚焦显微分析方法研究了切缝表面的熔凝层结构，评价了无损切割的良好质量。以激光切割过程的高速摄像CCD分析为基础，对激光峰值功率、占空比、频率、打孔时间等特征工艺参数进行了优化分析，给出了厚度不小于10 mm致密陶瓷激光无损切割的优化工艺参数，脉冲峰值功率2.7～3.5 kW，脉冲频率约50 Hz， 脉冲占空比30%～50%，通孔时间0.1～0.5 s。该技术直线切割速度可达15～20 mm/min。

Achievement of laser close-piercing lapping processing technique for damage-free cutting in arbitrary path (line, curve and angle) of dense Al2O3 ceramics with the thickness of 10～12 mm by CO2 laser is proposed. By the combination analysis of scan electron microscope (SEM) and laser scanning confocal microscope on the cut surface, the good cut quality is concluded. Based on the CCD analysis of the novel cutting processing, the optimal process parameters for damage-free cutting of 10 mm thick Al2O3 ceramics including peak power of 2.7～3.5 kW, pulse frequency of about 50 Hz, cycle duty of 30%～50% and piercing time of 0.1～0.5 s, are obtained. The optimal line cutting speed can be 15～20 mm/min.