常用的EDA软件如HSPICE中没有顶发射有机发光器件的仿真模型，导致设计硅基有机发光器件微显示像素驱动电路时存在困难.为此，本文研究了用于微显示的顶发射有机发光器件的SPICE仿真模型，分别讨论了二极管连接的MOS管模型、单个二极管以及双二极管并联模型等方案，分析了其等效电路，同时根据顶发射有机发光器件的实验数据拟合了对应的电路参量，最后用HSPICE软件对三种模型的等效电路进行仿真和结果比较.比较发现采用二极管连接的MOS管模型得到的拟合误差最小，但仿真误差最大；采用单个二极管模型得到的拟合与仿真误差都较大；采用双二极管并联模型得到的拟合与仿真误差均较小且满足驱动电路设计的要求.结果表明双二极管并联模型可作为用于硅基有机发光器件微显示电路设计中的顶发射有机发光器件的SPICE仿真模型.

Popular EDA software such as HSPICE do not have the simulation model of OLED or top-emitting OLED,so it is difficult to design the OLED-on-Silicon pixel driving circuits in microdisplay applications.To solve the problem,the simulation model of top-emitting OLED for microdisplay was studied in this paper.Moreover,three types of equivalent circuit model,which are the single-diode model,the double-diode paralleled model and their equivalent circuits are discussed respectively.Meanwhile,the circuit parameters are got after fitting the I-V curve of the top-emitting OLED,finally all the simulated data from the equivalent circuits by HSPICE and the original I-V curve was compared.The results show that the fitted errors obtained from the diode-connected NMOS model are the smallest one,but its simulated errors are the largest one.The fitted errors and the simulated errors from the single-diode model are relatively large,too.But,smallest fitted errors and simulated errors are got using double-diode paralleled model,and the errors are small enough to satisfy the requirements of designing pixel driving circuits.Finally,the double-diode paralleled model is selected as the SPICE model for top-emitting OLED used in microdisplay.