半导体光子学与技术, 2006, 12 (1): 39, 网络出版: 2011-08-18
Low Temperature Wafer Level Hermetic Package with Benzo-cyclo-butene Material
Low Temperature Wafer Level Hermetic Package with Benzo-cyclo-butene Material
摘要
Abstract
AThe wafer level hermetic package method was studied experimentally in low temperature for optoelectronic devices with benzo-cyclo-butene(BCB) material. The results show that the bonding temperature is below 250℃, the helium hermetic capability of both silicon2BCB-silicon and silicon2BCB-glass package are better than 6×10-4Pa·cm3/s. The shear strength is enough for package. The hermeticity is still good after the 15 cyclespthermal shock test. The relationship between the leakage rate and the distance from the hole to the device border were also discussed with a seepage model.
LIU Yu-fei, LIU Wen-ping, LI Si-hua, WU Ya-ming, LUO Le. Low Temperature Wafer Level Hermetic Package with Benzo-cyclo-butene Material[J]. 半导体光子学与技术, 2006, 12(1): 39. LIU Yu-fei, LIU Wen-ping, LI Si-hua, WU Ya-ming, LUO Le. Low Temperature Wafer Level Hermetic Package with Benzo-cyclo-butene Material[J]. Semiconductor Photonics and Technology, 2006, 12(1): 39.
PDF全文
