电光与控制, 2011, 18 (8): 84, 网络出版: 2011-08-18   

SRAM型FPGA单粒子翻转测试及加固技术研究

Study on Testing and Harden Technique of Single Event Upset for SRAM-Based FPGA
作者单位
北京航空航天大学,北京100191
摘要
SRAM型FPGA空间应用日益增多,只有针对其特点设计相应的单粒子试验的测试程序才能系统、准确地获取该类芯片的单粒子翻转特性,为抗辐射加固设计提供依据。阐述了单粒子翻转的静态和动态的测试方法。静态测试包括硬件设计和配置位回读程序的设计; 动态测试主要针对CLB(配置逻辑单元)和BRAM(块存储器)两部分进行了相应的软件测试程序设计; 并结合工程给出了解决单粒子翻转的主要加固方法。此试验得到了该类芯片的单粒子翻转截面,对在地面上进行FPGA的可靠性评估具有重要意义。
Abstract
With the increasing application of SRAM-based FPGA,only the specially designed testing program according to its features can obtain the accurate characteristics of single-event upset,which may supply the basis for strengthening anti-radiation.The static and dynamic methods for testing single event upset were described in detail.In static testing,the hardware and readback program of the test system were designed.In the dynamic testing, the corresponding software testing programs were designed for CLB and BRAM.Some efficient methods from engineering application were given to improve the reliability of field programmable gate array.The testing obtained the upset cross sections,which are very important for evaluating the reliability of FPGA on the ground.

邱金娟, 徐宏杰, 潘雄, 朱明达. SRAM型FPGA单粒子翻转测试及加固技术研究[J]. 电光与控制, 2011, 18(8): 84. QIU Jinjuan, XU Hongjie, PAN Xiong, ZHU Mingda. Study on Testing and Harden Technique of Single Event Upset for SRAM-Based FPGA[J]. Electronics Optics & Control, 2011, 18(8): 84.

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