半导体光子学与技术, 2008, 14 (1): 56, 网络出版: 2011-08-19
Design and Simulation of High-power LED Array Packaging
Design and Simulation of High-power LED Array Packaging
摘要
Abstract
Thermal management is one of the key technologies for high-power Light emitting diode(LED) entering into the general illuminating field. Successful thermal management depends on optimal packaging structure and selected packaging materials. In this paper, the aluminum is employed as a substrate of LED, 3×3 array chips are placed on the substrate, heat dissipation performance is simulated using finite element analysis(FEA) software, analyzed are the influences on the temperature of the chip with different convection coefficient, and optical properties are simulated using optical analysis software. The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.
TIAN Da-lei, GUAN Rong-feng, WANG Xing. Design and Simulation of High-power LED Array Packaging[J]. 半导体光子学与技术, 2008, 14(1): 56. TIAN Da-lei, GUAN Rong-feng, WANG Xing. Design and Simulation of High-power LED Array Packaging[J]. Semiconductor Photonics and Technology, 2008, 14(1): 56.