半导体光子学与技术, 2010, 16 (2-3): 120, 网络出版: 2011-08-19
Study on High-power LED Heat Dissipation Based on Printed Circuit Board
Study on High-power LED Heat Dissipation Based on Printed Circuit Board
high-power LED printed circuit board(PCB) substrate of heat dissipation thermal resistance junction temperature
摘要
Abstract
In order to study the role of printed circuit board(PCB) in high-power LED heat dissipation, a simple model of high-power LED lamp was designed. According to this lamp model, some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents. The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB. However, PCB with low thermal resistance can be matched with smaller volume heat sink, so it is hopeful to reduce the size, weight and cost of LED lamp.
WANG Yiwei, ZHANG Jianxin, NIU Pingjuan, LI Jingyi. Study on High-power LED Heat Dissipation Based on Printed Circuit Board[J]. 半导体光子学与技术, 2010, 16(2-3): 120. WANG Yiwei, ZHANG Jianxin, NIU Pingjuan, LI Jingyi. Study on High-power LED Heat Dissipation Based on Printed Circuit Board[J]. Semiconductor Photonics and Technology, 2010, 16(2-3): 120.