垂直耦合结构纳米微环谐振器是光子集成电路的重要组成单元。主要研究了与其实际制作相关的工艺失准问题。针对高折射率差波导材料垂直耦合结构纳米微环谐振器，先用耦合模理论解析方法研究了耦合系数与直波导和微环波导耦合层厚度d以及横向偏移量Δ之间的关系，为三维时域有限差分法（3D-FDTD）的精确数值计算确定了模拟范围。之后结合解析方法和3D-FDTD数值计算研究了Δ和d的制作工艺容差。研究发现，当d=30 nm，偏移量Δ在130~265 nm之间变化时，耦合系数始终保持在较高值，为垂直耦合结构纳米微环谐振器的工艺制造提供了很大容差，对其实际制作较有意义。

Microring resonators are key components in nowadays photonic integrated circuits. A vertical microring resonator with enhanced tolerance to fabrication misalignments is introduced. Both straight and microring waveguides are with relatively high refractive-index difference between the core and cladding, therefore the vertical microring resonator is compact and confines the power efficiently. Based on coupling mode theory, the coupling coefficient is derived as a function of the coupling layer thickness (d) and the transverse offset (Δ) between the straight and microring waveguides. The analytic solutions are used to confine the range of three-dimensional finite-different time-domain (3D-FDTD) simulations for their efficiency. In addition, the tolerance of d and Δ is studied by taking consideration of actual fabrication technology for the vertical nano-microring resonator. The analytic solutions and simulation results show that when d=30 nm, the vertical microring resonator has a large coupling coefficient even Δ is varied from 130 to 265 nm. It is verified that the vertical nano-microring resonator has enhanced tolerance to fabrication misalignments.