光学 精密工程, 2011, 19 (11): 2791, 网络出版: 2011-12-05   

面阵CCD KAI-0340DM高速相机的设计

Design of high speed camera system with area-CCD KAI-0340DM
作者单位
1 中国科学院 长春光学精密机械与物理研究所,吉林 长春 130033
2 中国科学院 研究生院,北京 100039
摘要
使用常规CCD设计了高速相机系统,并解决了相机高速工作方式下的一系列难题。介绍了行间转移面阵CCD芯片KAI-0340DM的工作原理,采用高度集成视频处理芯片来产生各高速时序信号;通过提高驱动芯片与线路板的热传导效率增加有效散热面积从而降低芯片的温升;建立了高速运放电路的自激振荡模型,并采用有效方法克服了自激振荡;采用串并转换的方法降低了数据整合的难度,通过压缩图像数据的消隐期对输出数据进行异步降频并使用Camera Link接口来传输数据。实验结果表明,该相机系统工作时驱动器温升仅5.2℃,信噪比>40 dB,动态范围不低于60 dB,可在4种分辨率下工作,当分辨率为640×480时,可在时间延迟积分(TDI)方式下工作。当相机的分辨率为228×164,帧频为1 000 frame/s,基本满足高速摄像的应用要求。
Abstract
A camera system was designed by using conventional CCDs and several problems in a high-speed mode were saved. After introducing to the working principle of a interline array CCD KAI-0340DM, a highly integrated CCD signal processor was used to produce the high-speed timing signals. By improving the heat conduction efficiency between chip and board,the heat conduction area was enlarged so that temperature rising was reduced. A high-speed op-amp self-oscillation model was established, and the self-oscillation was overcome. Furthermore, the difficulty of data processing was reduced by the serial to parallel conversion. Finally, data was transmitted through Camera Link Interface,and output data were asynchronous depressed in frequence by compressing the blanking interval. The results show that the temperature has only gone up 5.2℃ when the camera system works; its signal to noise ratio is greater than 40 dB, and dynamic range is not less than 60 dB. The camera can work under the four resolutions. When the cameras resolution is 640×480,it can work in the Time Delay Integral(TDI)mode. When it is 228×164, frame frequency is 1 000 frame/s, it can meet the camera’s basic application requirements.

余达, 郭永飞, 周怀得, 武星星, 李广泽, 吕世良, 刘金国. 面阵CCD KAI-0340DM高速相机的设计[J]. 光学 精密工程, 2011, 19(11): 2791. YU Da, GUO Yong-fei, ZHOU Huai-de, WU Xing-xing, LI Guang-Ze, L Shi-liang, LIU Jin-guo. Design of high speed camera system with area-CCD KAI-0340DM[J]. Optics and Precision Engineering, 2011, 19(11): 2791.

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