有机电致发光器件的稳定性与其封装结构密切相关，封装技术的优劣直接影响有机电致发光二极管器件的寿命.本文采用热阻抗模型对三种常用有机电致发光二极管器件封装结构进行热阻抗分析，并利用ANSYS有限元分析软件的热分析模块对热特性进行研究，得出各种器件封装结构的温度场分布，根据温度场分布比较得出各种封装结构散热性能的差异.分析得出,传统后盖式封装结构与混合封装结构散热效果相差不大，Barix封装结构具有最好的散热性能.模拟仿真结果显示,当玻璃厚度从0.5 mm增加至0.9 mm时，传统封装结构的发光层温度升高了0.124℃，Barix封装结构的发光层温度升高了0.262℃，表明玻璃层厚度的增减对有机电致发光二极管器件的散热影响较小.改变器件表面空气流动速度，使对流系数从25W/(m2·K)变为85W/(m2·K)时，传统封装结构有机电致发光二极管发光层的温度由42.911℃递减到26.85℃，可见增大表面空气流动速度对降低有机电致发光二极管有源层的温度作用显著.

The stability of OLED device is closely related to the encapsulation structure, while the quality of the encapsulation technology will have a direct impact on the lifetime of OLED device. Several familiar OLED encapsulation structures are introduced, adopting the thermal impedance model to analyse the impedance of these encapsulation structures. And by using the thermal analysis module of the ANSYS finite element analysis software, the thermal characteristics of these packaging technologies are researched, obtaining the temperature field distribution of each structures. The differences of the heat dissipation performance are derived through comparison. There′s not much difference in the effect of heat dissipation between the traditional encapsulation structure and the hybrid encapsulation structure, while the Barix encapsulation structure has the best heat dissipation performance. The simulation results show that when the thickness of the glass increases from 0.5 mm to 0.9 mm, the temperature of luminous layer of traditional encapsulation structure raises 0.124 ℃, and that of Barix encapsulation structure only raises 0.262 ℃, which indicates that the heat dissipation performance has little to do with the thickness of the glass layer. When changing the airflow rate of the surface of the device to make the convection coefficient increase from 25 W/(m2·K) to 85 W/(m2·K), the temperature of luminous layer of traditional encapsulation structure decreases from 42.911 ℃ to 26.85 ℃, which has a remarkable impact on reducing the temperature of the active layer.