半导体光电, 2011, 32 (2): 192, 网络出版: 2012-01-04
高强度带光窗光电外壳设计
Design of High Intensity Photoelectric Package with Optical Window
摘要
选取窗口结构强度相对较弱的圆形平面玻璃光窗外壳,就该类外壳最薄弱的带光窗管帽受力状态进行了有限元分析,根据强冲击下结构与应力的变化趋势优化设计了管帽结构,结果显示经结构优化的管帽能承受1×104g的强冲击,满足光电器件封装的高强度要求。
Abstract
Taking the circular flat package with weak glass window as the research object, the underforce status of the cap with optical window was analyzed with the method of finite element. The cap structure would be modified according to the variation tendency of the caps structure and stress under strong impact so as to satisfy the requirement of high strength packaging.
袁礼华, 袁中朝, 谭千里. 高强度带光窗光电外壳设计[J]. 半导体光电, 2011, 32(2): 192. YUAN Lihua, YUAN Zhongchao, TAN Qianli. Design of High Intensity Photoelectric Package with Optical Window[J]. Semiconductor Optoelectronics, 2011, 32(2): 192.