激光技术, 2012, 36 (3): 364, 网络出版: 2012-05-22
模具半导体激光强韧化工艺研究
Process research of diode laser surface hardening for dies
摘要
为了研究模具材料半导体激光表面强韧化工艺,采用半导体激光表面淬火工艺,进行了7CrSiMnMoV,Cr12MoV,CrMo铸铁等典型模具材料半导体激光淬火的工艺研究,得到了不同模具材料优化的激光工艺参量。结果表明,激光表面淬火后的硬度满足模具材料的使用要求。这一结果为激光模具表面强韧化处理提供了可靠的保障。
Abstract
In order to improve the surface hardness and toughness of dies, several typical die materials, such as 7CrSiMnMoV, Cr12MoV, CrMo cast iron, were hardened with a high power diode laser and the optimal laser parameters were obtained. Results show that the optimal laser parameters can meet the requirement of the hardness of dies and provide a guarantee to the hardness and toughness of dies in future application.
闵大勇, 王爱华, 熊志红, 卢飞星. 模具半导体激光强韧化工艺研究[J]. 激光技术, 2012, 36(3): 364. MIN Da-yong, WANG Ai-hua, XIONG Zhi-hong, LU Fei-xing. Process research of diode laser surface hardening for dies[J]. Laser Technology, 2012, 36(3): 364.