中国激光, 1987, 14 (10): 635, 网络出版: 2012-08-10
激光增强电镀铜
Laser enhanced copper plating
摘要
Abstract
The mechanism and experimental method for laser enhanced plating are described. With this new technique we got spots and lines of copper plated on glass substrates-. A plating rate of 0.1-lum/s and plating enhancement ratio on the order of 103 have been obtained.
袁加勇, 李士杰, 王静环, 王茂鑫, 秦亮, 陈琪. 激光增强电镀铜[J]. 中国激光, 1987, 14(10): 635. Yuan Jiayong, Li Shijie, Wang Jinghuan, Wang Maoxin, Qin Liang, Chen Qi. Laser enhanced copper plating[J]. Chinese Journal of Lasers, 1987, 14(10): 635.
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