发光学报, 2012, 33 (7): 768, 网络出版: 2012-08-15
氮化铝薄膜的硅热扩散掺杂研究
Study of AlN Films Doped by Si Thermal Diffusion
摘要
采用热扩散方法, 对AlN薄膜进行了Si掺杂。利用电子能量散射谱(EDS)以及高温变温电导对薄膜进行了分析。EDS测试结果表明:在1 250 ℃的温度下, 氮化硅(SiNx)作为Si的扩散源, 可以实现对AlN薄膜的Si热扩散掺杂。高温电流-电压(I-V)测试表明:在460 ℃测试温度下, AlN薄膜在热扩散掺杂以后, 其电导从1.9×10-3 S·m-1增加到2.1×10-2 S·m-1。高温变温电导测试表明:氮空位(V3+N)和Si在AlN中的激活能为1.03 eV和0.45 eV。
Abstract
This paper deals with the characteristics of aluminium nitride (AlN) films doped by silicon (Si) thermal diffusion. The films are analyzed by energy dispersive X-ray spectroscopy (EDS) and high-temperature dependent electrical conductivity. The results of EDS show that the Si element is successfully doped into the AlN films using SiNx as the diffusion source at the temperature of 1 250 ℃. The high-temperature current-voltage (I-V) measurements show that the electrical properties of the AlN films can be prominently improved by Si thermal diffusion, and at the measured temperature of 460 ℃ their electrical conductivities increase from 1.9×10-3 S·m-1 to 2.1×10-2 S·m-1 after the Si thermal diffusion. The high-temperature dependence of thermal conductivity suggests that the activation energies of V3+N and Si are about 1.03 eV and 0.45 eV, respectively.
王新建, 宋航, 黎大兵, 蒋红, 李志明, 缪国庆, 陈一仁, 孙晓娟. 氮化铝薄膜的硅热扩散掺杂研究[J]. 发光学报, 2012, 33(7): 768. WANG Xin-jian, SONG Hang, LI Da-bing, JIANG Hong, LI Zhi-ming, MIAO Guo-qing, CHEN Yi-ren, SUN Xiao-jun. Study of AlN Films Doped by Si Thermal Diffusion[J]. Chinese Journal of Luminescence, 2012, 33(7): 768.