实验采用玻璃湿法腐蚀凹槽制备了用于有机电致发光器件封装的玻璃后盖,并分析了氢氟酸浓度、温度、超声和反应物对玻璃刻蚀厚度和玻璃表面平整度的影响,得到了一种简单制备玻璃盖的工艺方法: 在氢氟酸浓度为40％，在超声波清洗器中进行玻璃的腐蚀，腐蚀时间为15 min，在腐蚀过程中间隔一定时间冲洗反应物后可以得到厚度为0.177 mm，表面平整的玻璃封装盖，符合有机电致发光器件的封装要求。使用此方法制备的封装盖在氮气环境下将有机电致发光器件进行封装，可以减缓器件亮度的衰减。

Cover glass for OLED encapsulation was made by wet etching technology. The impact of concentration of hydrofluoric acid, temperature, ultrasound and reactant on thickness and surface smoothness was studied. The best method to make cover glass was obtained: In the ultrasonic cleaner, the concentration of hydrofluoric acid was 40%, corrosion time was 15 min and the corrosion process cleared the reactant, then we got 0.177 mm smooth surface cover glass, which was coincident with the encapsulation standard of organic electroluminescent devices. Organic Light-Emitting Diodes were encapsulated using cover glass made by this method in a nitrogen atmosphere, the attenuation rate of luminance of these devices can be slowed down.