发光学报, 2012, 33 (11): 1258, 网络出版: 2012-11-13  

用反应溅射法沉积SiOx绝缘层的InGaZnO-TFT的光照稳定性

The Stability of IGZO-TFT with Reactive Sputtered SiOx Insulator under White Light Illumination
作者单位
1 上海大学 材料科学与工程学院, 上海 200072
2 上海大学 新型显示技术与应用集成教育部重点实验室, 上海 200072
摘要
制备了基于反应溅射SiOx绝缘层的InGaZnO-TFT, 并系统地研究了InGaZnO-TFT在白光照射下的稳定性, 主要涉及到光照、负偏压、正偏压、光照负偏压和光照正偏压5种情况。结果表明, 器件在光照和负偏压光照下的阈值偏移较大, 而在正偏压光照情况下的阈值偏移几乎可以忽略。采用C-V方法证明阈值电压漂移是源于绝缘层/有源层附近及界面处的缺陷。另外, 采用指数模式计算了缺陷态的弛豫时间。本研究的目的就是揭示InGaZnO-TFT在白光照射和偏压下的不稳定的原因。
Abstract
We systematically investigated the stability of gallium indium zinc oxide (IGZO) thin film transistor (TFT) with reactive sputtered SiOx insulator under white light illuminaion. The research involved an overall stress conditions that included light stress (LS), negative voltage stress (NBS), positive voltage stress (PBS), negative bias-light stress (NBLS), and positive bias-light stress (PBLS). The results demonstrate a large threshold voltage shift under LS and NBLS conditions, and a negligible threshold voltage shift under PBLS condition. The C-V characteristics indicated that the shift of threshold voltage came from traps generated at or near the dielectric/semiconductor interface. Additionally, the stretched exponential model was used to obtain the relaxation time. This work aimed to provide an instability origin of IGZO-TFT under white light illumination and gate voltage bias.

李俊, 周帆, 张建华, 蒋雪茵, 张志林. 用反应溅射法沉积SiOx绝缘层的InGaZnO-TFT的光照稳定性[J]. 发光学报, 2012, 33(11): 1258. LI Jun, ZHOU Fan, ZHANG Jian-hua, JIANG Xue-yin, ZHANG Zhi-lin. The Stability of IGZO-TFT with Reactive Sputtered SiOx Insulator under White Light Illumination[J]. Chinese Journal of Luminescence, 2012, 33(11): 1258.

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