光学仪器, 2011, 33 (2): 83, 网络出版: 2012-12-06  

透红外硫系玻璃微压印工艺的仿真研究

Simulation study on micro-molding process of infrared chalcogenide glass
作者单位
西安工业大学 微光电系统研究所,陕西 西安710032
摘要
为了获得更好的微压印工艺填充效果,利用有限元方法研究模压工艺的主要参数压印温度、压印力和压印时间对压印效果的影响,并对工艺参数进行优化;对压印过程中不同的模具结构的应力分布进行了研究。仿真结果表明,工艺参数优化为480℃,30N,1800s后,模具的填充率达到97.2%;对不同的模具结构,有相同的应力分布区域,在模具拐角处会有应力的高度集中,与模具接触区域的应力相对较高,模具腔体区应力最低。
Abstract
In order to acquire a better filling effect of micro-molding process, the method of finite element analysis is used to study the effect of molding temperature, molding force and time on molding process, and the process parameters are optimised; stress distribution of different mold structures are also been studied. Simulation results showed that the mold′s filling ratio will achieve 97.2% if we choose the optimised process parameter(480℃, 30N, 1800s). For different mold structures the area of stress distribution is the same. The stress will highly concentrated at the corner of the molds. The stress will relatively increase at the contact area between molds and substrates. The stress value in the molds′ cavity is the lowest.

沈萍, 刘卫国. 透红外硫系玻璃微压印工艺的仿真研究[J]. 光学仪器, 2011, 33(2): 83. SHEN Ping, LIU Weiguo. Simulation study on micro-molding process of infrared chalcogenide glass[J]. Optical Instruments, 2011, 33(2): 83.

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