针对激光加工在金属材料焊接、熔覆、表面硬化等工业领域的应用, 考虑到半导体激光器体积和重量小、效率高、免维护、成本低以及波长较短等特点, 设计了功率达2 kW的半导体激光加工光源。在大通道工业水冷条件下, 采用48只出射波长分别为808, 880, 938, 976 nm的传导冷却半导体激光阵列作为发光单元, 最终研制出了2 218 W高亮度光纤耦合模块。此高亮度模块可以实现柔性加工, 直接应用于金属材料焊接、熔覆、表面合金化等工业领域, 对于半导体激光器在工业领域的应用具有重要意义。

The laser processing is widely used in the welding of metallic materials, cladding, surface hardening, and other industrial fields. The semiconductor laser has many advantages, such as small volume and weight, high efficiency, maintenance-free, low cost, short wavelength, and so on. In this paper, a 2 218 W high-brightness fiber-coupled module was designed and overall assembled by using 48 conduction cooled diode laser arrays as light-emitting units under a major thoroughfare of industrial water-cooling condition. The emitting wavelength of the diode laser arrays were 808, 880, 938, 976 nm, respectively. The high brightness module can make the flexible manufacturing directly applied in the industrial.