为满足LED光源在照明领域的需求, LED封装技术需要解决光源稳定性和出光效率两大问题。在分析传统LED封装技术的基础上, 提出一种新型的封装方式——多反光杯LED封装, 即在传统LED基板上设计并制作多个光学反光杯, 并将LED芯片封装在这些反光杯中。研究发现采用该封装方式, 不仅使得光源具有良好的稳定性, 而且可以保持较高的出光效率。该封装方式具有设计灵活以及使用方便的特点。

The stability of light source and luminous efficiency are the two key problems in LED package. Based on traditional package methods, a new design named Multi Reflector Cup on Board（MRCOB）was proposed. First multi-reflector cups were fabricated on traditional LED board, and then LED chips were packaged into the reflector cups. It is found that using this package method, the light source can obtain uniformity spots, better stability and higher luminous efficiency. Moreover, the design of MRCOB is flexible and easy to use.