基于环摆双面抛光技术，研究了3 mm厚大口径超薄元件的双面抛光加工工艺。通过对双面抛光原理的分析，对转速比、抛光垫面形、抛光液等工艺参数上作了优化，并通过加工模拟进行验证。通过工件环分离器减薄技术解决了3 mm厚超薄元件的装夹问题。在SYP152双面主动抛光机上进行了加工工艺实验，通过调节转速比实现3 mm厚大口径超薄元件面形的高效收敛，验证了加工的可行性，并且达到了面形精度优于1.5λ(λ=632.8 nm)、表面粗糙度优于1 nm的技术水平。

We studied the double-side polishing process of large-aperture ultra-thin component based on the technology of ring polishing and pendulum. The technical optimization included the speed ratio control, polishing pad shape modification and polishing particle size convergence. Computer simulation produced evidence in support of the optimization. The trouble of ultra-thin component’s damage in original separator was overcome by material replacement and separator thinning. We achieved the convergence of surface shape by adjusting the speed ratio on SYP152 double-side polishing machine. Through these experiments, we verified the feasibility of this processing method, the surface PV value could attain to less than 1.5λ(λ=632.8 nm) , the surface roughness could be reduced to less than 1 nm.