设计了皮秒激光加工系统，该系统可输出355、532、1064 nm皮秒脉冲激光，单脉冲能量最大1.5 mJ，脉冲宽度9.12 ps。进行了轴向色差补偿设计，轴向焦点补偿最大距离0.4 mm，最小焦斑直径为3 μm，峰值功率密度达0.6×1015 W/cm2。应用该系统，开展了不同波长与不同材料作用的加工实验研究。研究表明，1064 nm皮秒脉冲激光可用于手机屏幕切割，532 nm皮秒脉冲激光可用于光电探测器制作，355 nm皮秒脉冲可用于精细度要求较高的金属类材料加工。

A picosecond laser machining system is designed, which can output 355、532、1064 nm picosecond laser. The maximum single pulse energy is 1.5 mJ and the pulse width is 9.12 ps. Through the axial aberration compensation design, the maximum distance of axial focus compensation is 0.4 mm, the diameter of minimum focal spot is 3 μm and the maximum peak power density is 0.6×1015 W/cm2. With this system, the machining experiment of different wavelengths and different materials is completed. The results show that 1064 nm picosecond laser can be used to cut mobile phone screen, 532 nm picosecond laser can be used to product photoelectricity detector and 355 nm picosecond laser can satisfy micro-machining requirements of metal materials.