随着像素单元越来越小、阵列规模越来越大、帧频越来越快,传统的IRFPA面临很大的集成技术发展瓶颈。基于三维集成的红外焦平面阵列(3D-IRFPA)通过堆叠芯片集成了A/D转换器、数字信号处理器、存储器等模块,可突破像元面积、阵列规模、帧频等瓶颈,实现探测器更强大的功能和更高的性能。本文介绍了3D-IRFPA技术的结构原理、优势、面临的挑战,以及最新技术进展。

As the pixel area is smaller, the array size is larger and the frame rate is higher, integrated technology has become a bottleneck for the traditional IRFPA. Through stacking chips, the 3D-IRFPA integrates with A/D convertor, DSP and memory so that it breaks the bottleneck brought on by pixel area, array size and frame rate and leads to more powerful function and higher performance. This paper presents the structure principle, the advantages, challenges and state of art of 3D-IRFPA.