对大功率LED而言, 如何保持芯片结温在允许的范围内, 是散热系统设计的关键。针对大功率UV-LED印刷灯, 设计了热管加风冷翅片的散热模型方案, 采用热分析软件模拟得到散热模型的温度和流动分布, 并对散热模组进行不同输入功率下的实验测试, 对比分析了仿真模拟和实验测试的芯片结温值和热沉到环境热阻值等结果, 发现仿真模拟和实验测试结果有较好的一致性, 说明热管加风冷翅片比传统风冷翅片有更好的散热性能。

For the design of high power LED heat dissipation system, it is a key factor to maintain the range of junction temperature in allowance. In this paper, a special heat dissipation system scheme-heat pipe with air cooling fins-for high power UV-LED printing lights is presented. The temperature and flow distribution of this scheme are simulated by thermo analysis software, and especially a module based scheme is investigated experimentally under the variable input powers. Compared with the results of chip junction temperature and the thermal resistance from heat sink to atmosphere obtained in simulations and from experiments, it was found that the experimental results have good agreement with those in simulations. It can be concluded that heat pipe with air cooling fins has a better performance in heat dissipation than the traditional air cooling fins.